Company Information

  • Trade nameFIRST Co., Ltd.
    Headquarters address4-18-4 Ikejiri, Setagaya-ku, Tokyo 154-0001
    [ Access map ]
    TEL+81-3-3414-9474
    FAX+81-3-3414-9470
    URLhttp//www.first-cad.com
    EstablishedAugust 22, 1988
    Capital stock10 million yen
    Fiscal year endJuly 31
    Major banksSumitomo Mitsui Banking Corporation
    Board memberRepresentative Director Kazuharu Baba
    Directors Kazuko Baba、Seiichi Matsumoto
    Number of employees11
    Business ContentDevelopment and sales of CAD/CAM integrated programming EDA software 'Start'.
    Training/Operational support/Technical assistance/Customized development services

    • 会社沿革

    August 1988First Co., Ltd. was established in Ikejiri, Setagaya-ku, Tokyo.
    October 1988We have launched the development project for our original EDA tool, 'Start'.
    October 1991CAD/CAM software "Start" for electronic devices released on UNIX/OS.
    May 1997The Windows NT version was released simultaneously with the version upgrade.
    October 1998Expanded flexible PCB design/editing elements and released.
    July 2001Delivered for use in Sony's chip-size package (CSP) design tool.
    April 2004We have released "Start" Ver3, which supports semiconductor cell data GDSⅡ.
    December 2006Supports English, Korean, and Chinese.
    August 2008CAE (analysis tool ANSYS/etc.) industry's first direct interface released.
    August 2009Adopted as a design tool for three-dimensional integrated structures in the national project "ASET".
    January 2011Adopted by AIST (National Institute of Advanced Industrial Science and Technology) as a Si interposer design tool for three-dimensional structural substrates.
    May 2012We have released a version of our customizable programming language "SeF" that comes standard with the product.
    December 2013Adopted as a design tool for optoelectronic composite circuit wiring in NEDO Project "PETRA"
    May 2014We are constructing our own building in Ikejiri, Setagaya Ward, Tokyo.
    December 2015Release of manufacturing equipment (processing machines, exposure machines, mounting machines, inspection machines) and direct control systems..
    May 2018We have released the industry's first interactive interface with NEC's [DEMITASNX].
    August 2020Unicode, the international industry standard for character encoding, has been released in version 5.0.
    April 2021Adopted for NEDO's 5G project and the development of the 3DIC quantum computer implementation.
    August 2022JIEP System Integration Committee Chiplet Study Group Founding Members
    November 2023TOOL Corporation's LAVIS product and FIRST Corporation's START product have signed an agreement for collaborative development.
    January 2024Start has begun accepting design contracts and dispatching designers.
    April 2024Logic Research Co., Ltd. and I have signed a joint development agreement for EDA software for chiplet SOC design.
    May 2024We have signed a cooperation agreement with Advanced Photonics, Inc. to provide technical support for the development of CPO design functions.
    September 2025We have launched a complete package for POL (Power Overlay), from chip/package/board design/editing to manufacturing equipment interface.

    主な導入ユーザー

    イビデン(株)  日本サムソン研究所(株)  ルネサスエレクトロニクス(株)  デバイステック(株)  アムコーテクノロジージャパン(株)  先端フォトニクス株式会社  大日本印刷(株)  (株)デンソー  (株)ニコン  (株)ミクロ技術研究所  ソニー(株)  タツタ電線(株)  日本電気(株)  (株)大昌電子  コネクテックジャパン(株)  タカノ(株)  ヌヴォトン テクノロジージャパン(株)  (株)フジクラ  日東電工(株)  信越ポリマー(株)  キヤノンプレシジョン(株)  メイコー(株)  キヤノン(株)  日本発条(株)  帝国通信工業(株)  (株)日本マイクロ二クス  (株)金沢村田製作所  (株)ユピテル  シャープ(株)  日本シイエムケイ(株)  (株)日立情報通信エンジニアリング  スタンレー電気(株)  山一電機(株)  富士フイルム(株)  Orbaray(株)  富士通インターコネクトテクノロジーズ(株)  オリンパス(株)  パナソニック(株)  日本電産コパル電子(株)  (株)ワコム  (株)ソノコム  トープロテクノサービス(株)  ワボウ電子(株)  東レエンジニアリング(株)  住友電工プリントサーキット(株)  アジアスニーズウエイ(株)  ステイ電子機器(株)  (株)丸和製作所  ローム(株)  山下マテリアル(株)  (株)進映社  (株)アルファー精工  スリーエム ジャパン(株)  京セラ(株)  アイオーコア(株)  東京プロセスサービス(株)  東洋精密工業(株)  アテネ(株)  中沼アートスクリーン(株)  日本フイルコン(株)  メッシュ(株)  (株)プロセス・ラボ・ミクロン  ミタニマイクロニクス(株) 

    ■Sales record: Approximately 520 companies / 1200 licenses
    ■Widely used, from next-generation research and development to manufacturing sites.
    ■More than half of the users who have implemented the system have customized it.

    国家プロジェクト・NEDOプロジェクト

    技術研究組合超先端電子技術開発機構(ASET)
    技術研究組合光電子融合基盤技術研究所(PETRA)
    Quantum annealing research and development, 3DIC/three-dimensional packaging technology
    Photonics Research Center Optoelectronic Fusion Module
    Development of ultra-low power consumption optoelectronic packaging system technology
    Research on noise reduction technology for LTE-class RFICs
    Development of ultra-low-loss SiC power devices
    etc.

    教育機関

    半導体研究育成センター研究・教育機関
    京都大学 大学院工学研究科
    東京大学先端科学技術研究センター
    独立行政法人国立高等専門学校機構
    etc.